Hi, I'm thinking of getting a Voltera for FPGA board proof of concepts and was wondering how finely it can print BGA pads for BGA packages.
The Xilinx FT(G)256 Fine-Pitch Thin BGA Package Specifications are on page 337 of this Document and broadly the solder balls of the BGA are 1.00 mm apart centre to centre, with the ball size minimum/nominal/maximum dimensions being 0.4/0.5/0.6 mm respectively.
This means at worst case Voltera would need to draw a grid of 16 times 16 pads, with their centers 1.00 mm apart, with each one no wider than 0.60 mm, and that would broadly (at the worst case) leave just 0.20 mm from the edge of each pad to the edge of the next one.
Is Voltera capable of drawing a grid of 16 times 16, where each pad is 1mm apart (centre to centre), with each pad circa 0.5mm but at worst case 0.6mm?
This would, at worst case, leave 0.2mm between pads.
I won't be using all of the pins, btw, as I'd only be drawing double-sided instead of four layers, but I do need to know that where I have adjacent pins, that Voltera can handle the accuracy.
Does anyone have any experience that illuminates some light on this?