Everything went fine depositing and baking the conductive ink, but I’m having a lot of issues with the soldering paste. The deposition is great and I put the resistors, ICs and other stuff with ease, but when I reflow everything the soldering seems to fuse only to itself and pops the components up instead of fixing them to the conductive ink paths. It is almost as if the solder paste does not want to wick over the traces made with conductive ink (I’ve confirmed I’m using the right settings with the right solder paste name). The melted solder paste then goes beneath some of the components like LED or resistor and brings them upwards, which obviously makes it more difficult for any solder in the right place to connect to the component. I’ve varnished my boards for 20s+ until the traces are shiny, but I still have the same issue.
