We released a software update (0.16.0) a few hours ago which tweaked the solder paste parameters to address this issue, and also includes a feature which allows you adjust further if required. Once the update downloads and installs, click on the Solder flow - you’ll notice that you are now prompted to select which solder paste you’re using. Select the one which matches your solder paste.
Before changing any settings, I’d suggest just trying to paste as normal - as mentioned, we tweaked the paste printing parameters, which should prevent the paste from running out during a print.
How To Adjust For Paste Running Out Over Time
If you’re still seeing the issue, click on the gear icon in the top right corner of the screen to open the settings window - you’ll see that the settings window is now split by the types of materials. instead of just shoving everything into one tab. Click the Solder tab, then select your paste (for you, it would be OriginalPaste). In the Dispensing section, at the bottom right, you’ll see a parameter called rheological setpoint:
If you see that your paste is still running out over time, increase it by 0.01 - the parameter is quite sensitive, so make small adjustments as necessary.
Please keep us posted - both if you see the update has resolved your issue, or if you need to tweak the rheological setpoint to get it working.