A couple of things I have found helpful:
when burnishing, it doesn’t take a lot of pressure. On some of my early circuits I would try to scrub really hard and I found it would take off too much material and damage traces. This then made it harder when trying to solder to it (you want as smooth a surface as possible). If you have an inspection scope, break off a small piece of the burnishing pad and hold it with tweezers and burnish a pad or two while examining it under the scope, and you will see what I mean.
Flux, Flux, FLUX! I cover my entire circuit in flux right after I burnish it. I use an MGChemicals flux pen for easy no-mess application. Even when solder pasting, I have found the flux can help. Also, pre tin as much as you can before applying it, and at least put more flux on all the pads/wires/contacts.
Temperature: I have found this to be absolutely critical. With the new tin bismuth solder, I set my soldering iron to 210 C. I have found this to be the optimum temperature for my equipment, but you may need to try a few temperatures to find the best on yours. Of note, 205 and 215 DO NOT WORK WELL on mine…so temperature is critical.
Put a blob of solder on your tip, flux the area you want to apply it to, then gently touch it. I have also found sometimes if you gently rub the tip on the surface (GENTLY or you will damage it), it helps it wet better.
Hope this helps.
Edit:
one last thing, just to confirm this is for the Tin Bismuth Silver solder. I use some I got from digikey: Chipquik SMDSWLTLFP32 which is Sn42/Bi57/Ag1, but I believe this is the same alloy that voltera now sells.