I have a couple of issues I’m facing, hoping there is a path forward:
I have a USB connector on the PCB that has mounting holes in the pad itself, so during the probe stage it ends up picking these and the probe goes right through the board messing the height measurement. Is there a way to mark such pads as ‘avoid during probe’?
I’m using an Insight 1507 chip which has two sizes of pads, for some reason the software is choosing a crazy injection path for solder paste and making 8+ movements for a tiny 0.4mm^2 pad, and even more than the larger 0.8mm^2 ones, so the entire chip basically ends up as a gray blob of paste. Is there any way to control the injection path of the pads. A simple dab of paste would be sufficient for these.
I’ve attached the solder paste gerber for reference.