Hi everybody!
Software Version v1.10.0 was just released. The app will automatically update, but in case it does not you can download it here. In this version we made some small changes to the way Flexible Conductive Ink and Solder Paste is dispensed:
Flexible Conductive Ink
The extra ink being dispensed at the beginning and end of a trace has been reduced. This ink is particularly compressible and often oozes in between traces, this release improves the issue. Also, the default printing settings have changed so to take advantage of the improvements, make sure you restore all settings to their default!
Soft Start Ratio - 0.40
Soft Stop Ratio - 0.40
Solder Paste
We have improved pad coverage for longer prints for T4 solder pastes (both alloys). Longer prints required users to constantly click the + button to maintain consistent flow, this should no longer be the case as the default printing settings have changed so make sure you restore all settings to their default!
Dispense Height - 0.10mm
Trim Length - 30mm
Rheological Setpoint - 0.22
That’s it for now!
