I'm reworking a section of the board that needed a ground pour for both signal and thermal purposes. I followed the standard practice of using a hatched pour for the Voltera, which made quite the rats nest when combined with the signal traces.
I've cut back on the area of the pour, and am considering just going solid. I'm guessing that I'll again run into the problem of the ink expiring rather than using it up, so I don't mind the amount of ink. But will there be a curing problem? I could see where the ink might bake well as individual traces, but an area with the ink just slathered on might be something else entirely.
So, any gotchas with that plan? (besides likely taking a loooong time with a 150um nozzle...)